The welding efficiency and long-term reliability of the b block. This process precisely controls the temperature curve to seamlessly weld the LCC (Leadless Chip Carrier) packaged optical module to the PCB substrate, achieving leadless surface mount technology (SMT) and avoiding issues such as cold soldering and concentrated thermal stress that may occur in traditional manual welding. The packaging materials and structure of the module have undergone special optimization, enabling them to withstand peak temperatures of up to 260°C during the reflow soldering process without damaging internal optoelectronic components, ensuring the consistency and stability of mass production. Reflow soldering technology also endows the module with more compact layout capabilities. Combined with the low-profile characteristics of LCC packaging, it can adapt to high-density circuit board designs and meet the deployment requirements of space-constrained scenarios such as servers and airborne equipment. In addition, this process significantly simplifies the production 流程，supports fully automated mounting, reduces manufacturing costs, and at the same time, the solder joints have high mechanical strength and excellent temperature resistance. It provides a solid guarantee for the module's anti-vibration and anti-thermal fatigue capabilities in harsh industrial-grade (-55°C to +85°C) environments, and is a key technical support for high-speed optical interconnection equipment to achieve efficient mass production and highly reliable operation.
Product Features:
2-channel transmit 2-channel receive / 4-channel transmit 4-channel receive parallel fiber optic channel
Supports single-channel 10.3125Gbps rate transmission
OM3 multimode fiber transmission distance of 100m
Options include flat fiber / round fiber / loose fiber / with spring / with guide pin
Single 3.3V power supply
Data differential signal input / output with CML level
I2C serial data interface for communication monitoring
Compact structural design, high density and high capacity
Reflow soldering
Application:
Support for high-speed data communication connections over very short distances
Interconnection between servers and storage arrays
Airborne radar
Other optical links
Ordering Information:
| model number | Package form | rate | wavelength | Transmission distance | Fiber optic types | Interface | Operating temperature |
| DTBBQ44-922*NJ2R* | LCC32 | 10Gbps | 850nm | 100m | Multimodal | MT | -40°C~+85°C |
| DTBBQ44-922*NM2R* | LCC32 | 10Gbps | 850nm | 100m | Multimodal | MT | -55°C~+85°C |
| DTBBP44-944*NJ2R* | LCC48 | 10Gbps | 850nm | 100m | Multimodal | MT | -40°C~+85°C |
| DTBBP44-944*NM2R* | LCC48 | 10Gbps | 850nm | 100m | Multimodal | MT | -55°C~+85°C |
