DT-1529Z can replace the Avago AFBR-1529Z

AFBR-1529Z analog transmitter utilizes a 650 nm LED source in a housing designed to efficiently couple into 1 mm Polymer Optical Fiber (POF) and 200 µm diameter Plastic-Clad Silica (PCS). Links up to 50 m are supported with 1 mm POF, and up to 200 m with 200 µm PCS. It is designed to interoperate with Avago´s HFBR-25xxZ, AFBR-25xxZ and AFBR-26xxZ receivers. The transmitter is a 4-pin device, packed in Versatile Link housing. Versatile Link components can be interlocked (N-plexed together) to minimize space and to provide dual connections with the duplex connectors. Various simplex and duplex connectors, as well as POF cables are available for Versatile Link components. Please contact Avago Technologies for details or visit our company website at www.gigac.com

Features

RoHS-compliant
Data transmission at signal rates from DC up to 10 MBd
Up to 50 meters distance with 1 mm Plastic Optical Fiber (POF) and 200 meters with 200 µm PCS
Operating temperature range of -40 °C to +85 °C
Compatible with Avago’s Versatile Link family of connectors, for easy termination of fiber

Applications

Industrial control and factory automation
Serial field buses
Intra-system links; Board-to-Board, Rack-to-Rack
Extension of RS-232 and RS-485
High voltage isolation
Elimination of ground loops
Reduces voltage transient susceptibility

Package and Handling Information

The Versatile Link package is made of a flame retardant VALOX1 UL 94 V-0 material and uses the same pad layout as a standard, eight pin dual-in-line package. These Versatile Link packages are stackable and are enclosed to provide a dust resistant seal. Snap action simplex, simplex latching, duplex, and duplex latching connectors are offered with simplex or duplex cables. 

Package Housing Color

Versatile Link components and simplex connectors are color coded to eliminate confusion when making connections. Receivers are black and transmitters are grey. 

Handling

Versatile Link components are auto-insertable. When wave soldering is performed with Versatile Link components, the optical port plug should be left in to prevent contamination of the port. Do not use reflow solder processes (i.e., infrared reflow or vapor-phase reflow). Non-halogenated water soluble fluxes (i.e., 0% chloride), not rosin based fluxes, are recommended for use with Versatile Link components. 

Versatile Link components are moisture sensitive devices and are shipped in a moisture sealed bag. If the components are exposed to air for an extended period of time, they may require a baking step before the soldering process. Refer to the special labeling on the shipping tube for details. 

Interlocked (Stacked) Assemblies (refer to Figure 4) 

Horizontal packages may be stacked by placing units with pins facing upward. Initially engage the inter-locking mechanism by sliding the L bracket body from above into the L slot body of the lower package. Use a straight edge, such as a ruler, to bring all stacked units into uniform alignment. This technique prevents potential harm that could occur to fingers and hands of assemblers from the package pins. Stacked horizontal packages can be disengaged if necessary. Repeated stacking and unstacking causes no damage to individual units.

Recommended Launch Application Circuit