PLCC (Plastic Leaded Chip Carrier) optical transceiver module uses a plastic pinned package with pins distributed around the periphery. It is large in size but easy to plug and unplug. Heat dissipatio
-- Gigac TechnologyPLCC (Plastic Leaded Chip Carrier) optical transceiver module uses a plastic pinned package with pins distributed around the periphery. It is large in size but easy to plug and unplug. Heat dissipation relies on a copper sheet design, with outstanding vibration and high-temperature resistance, making it suitable for harsh environments such as industrial control and automotive electronics. LCC (Leaded Chip Carrier) optical transceiver module uses a pinless bottom pad package with a compact structure, low thermal resistance and efficient heat dissipation. It combines flip-chip technology to achieve high-density integration, supports high-frequency signals (up to 56GHz) and high-speed transmission (such as 400Gbps), and is mainly used in scenarios with strict space and performance requirements such as data centers, mobile devices, and aerospace.
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